PCB Assembly for Consumer Electronics Systems

PCB Assemblies for Energy Generation and Control, Teleaudiovideo Pvt Ltd is here with the product “energy meter” for the appropriate energy consumption. We also assist our clients with all types of PCBA (Printed Circuit Board Assembly) for different products.

East India’s total operational quality performance is ensured by the following certifications:

ISO 9001:2015 (QMS)

Reverse osmosis Purifier (RO)
Reverse osmosis (RO) is a water purification process that uses a partially permeable membrane to remove ions, unwanted molecules and larger particles from drinking water. In reverse osmosis, an applied pressure is used to overcome osmotic pressure, a colligative property that is driven by chemical potential differences of the solvent, a thermodynamic parameter. Reverse osmosis can remove many types of dissolved and suspended chemical species as well as biological ones (principally bacteria) from water, and is used in both industrial processes and the production of potable water. The result is that the solute is retained on the pressurized side of the membrane and the pure solvent is allowed to pass to the other side. To be “selective”, this membrane should not allow large molecules or ions through the pores (holes), but should allow smaller components of the solution (such as solvent molecules, i.e., water, H2O) to pass freely.

Justifying our position as a leading manufacturer of premium quality circuit boards, we also offer PCBs for colour TVs. It is extensively used to mechanically support and electrically connect electronic components using conductive pathways, or traces, etched from copper sheets laminated onto a non-conductive substrate.

In assembly the bare board is populated (or “stuffed”) with electronic components to form a functional printed circuit assembly (PCA), sometimes called a “printed circuit board assembly” (PCBA).[40][41] In through-hole technology, the component leads are inserted in holes surrounded by conductive pads; the holes keep the components in place. In surface-mount technology (SMT), the component is placed on the PCB so that the pins line up with the conductive pads or lands on the surfaces of the PCB; solder paste, which was previously applied to the pads, holds the components in place temporarily; if surface-mount components are applied to both sides of the board, the bottom-side components are glued to the board. In both through hole and surface mount, the components are then soldered; once cooled and solidified, the solder holds the components in place permanently and electrically connects them to the board.

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